English translation for "pitched ball"

投手的合法投球

Related Translations:

pitching fold:  伏褶曲倾伏褶皱

pitch circle:  齿节圆分度圆节距圆节圆线

football pitch:  足球场

pitch apex:  节锥顶

no pitch:  投球无效

pitch axe:  鹤嘴斧

relative pitch:  相对间距相对跨距相对螺距相对音高（听觉）

square pitch:  45的屋顶坡度45度斜屋面屋面坡度

pitching rotation:  投球回身动作

tube pitch:  管心距

Example Sentences:

	1.	Fbga fine - pitch ball grid array 精细倾斜球状网阵排列
	2.	Basic operation : mouse the left key pitch ball . left descend cape to control for the strength , at strength for red pitch ball the best 基本操作：鼠标左键投球。左下角为力量控制，在力量为红时投球最佳。
	3.	Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array 半导体器件的机械标准化.第6 - 5部分:表面安装半导体器件外壳外形图绘制的一般规则.小螺距刃片栅格排列的设计指南
	4.	Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch ball grid array 半导体器件的机械标准化.第6 - 5部分:半导体器件包装用表面安装略图制备的一般规则.小螺距球面栅格排列的设计指南
	5.	Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for 1 , 50 mm , 1 , 27 mm and 1 , 00 mm pitch ball and column terminal packages 半导体装置的机械标准化.表面安装的半导体装置封装外形图绘制的一般规则. 1 . 5mm 1 . 27mm和1 . 00mm树脂球和引线端子封装的设计指南
	6.	Mechanical standardization of semiconductor devices - part 6 - 2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for 1 , 50 mm , 1 , 27 mm and 1 , 00 mm pitch ball and column terminal packages 半导体器件的机械标准化.第6 - 2部分:绘制表面安装半导体器件封装外形图的一般规则. 1 . 5mm 1 . 27mm和1 . 00mm树脂球和引线端子封装的设计指南
	7.	Mechnical standardization of semiconductor devices - part 6 - 2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for 1 , 50 mm , 1 , 27 mm and 1 , 00 mm pitch ball and column terminal packages 半导体器件的机械标准化.第6 - 2部分:半导体器件包装用表面安装略图制备的一般规则. 1 . 5 mm 1 . 27 mm和1 . 00 mm螺距球面和柱状终端包的设计指南

Similar Words：

"pitchboard" English translation, "pitchcirclediameter" English translation, "pitchcoke" English translation, "pitchdown" English translation, "pitche" English translation, "pitched battle" English translation, "pitched buoyancy" English translation, "pitched dressing" English translation, "pitched face" English translation, "pitched felt" English translation